Patent #9878515 B2
PACKAGED HOT-MELT PRESSURE SENSITIVE ADHESIVE
AI Summary
The present invention relates to a packaged hot-melt pres- sure sensitive adhesive comprising a hot-melt pressure sen- sitive adhesive composition and a coextrusion coating con- sisting of neat low density polyethylene, neat polypropylene, or neat ethylene vinyl acetate. The present invention further relates to the use of the packaged adhesive formed as individual forms in an adhesive application process, and the use of the packaged adhesive 1n the production of laminated articles, including nonwoven hygiene articles, disposable medical drapes, and also laminate constructions such as tapes and labels.
Inventors
Dirk Laukien, Radbruch (DE),
Lynne Purvis, Viborg (DK),
Nicholas Porro, Wilmington, DE (US),
Nicholas Taylor, Oakwood (GB),
Peter Remmers, Hamburg (DE)
Jan. 30, 2018